User Meeting

TOPA User Meeting

at WD
Microscopy Solutions for Semiconductor Materials Research & Its Advanced Characterization Techniques
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ZEISS ON YOUR CAMPUS

Microscopy Solutions for Semiconductor Materials Research & Its Advanced Characterization Techniques

Descriptive text about what the User Meeting entails.

Join us for an immersive exploration of 3D X-ray microscopy at NTU! Engage with industry experts and academic leaders in hands-on sessions, workshops, and insightful welcome addresses. Learn about the latest materials science and metallurgy advancements while networking with fellow researchers and professionals. Plus, enjoy complimentary lunch and tea breaks. Reserve your spot today, as there are limited seats available!

This workshop serves as a platform for researchers to exchange their most recent findings in advanced metallurgy studies. Supporting research solutions such as 3D X-ray microscopy that enable non-destructive 3D imaging and 3D crystallography studies will be presented. Some of the application case studies presented in this workshop include the imaging and analysis of features, process defects and fracture behaviour from additive-manufactured alloys. 4D investigation of structures via in-situ or ex-situ testing, corrosion and stress corrosion cracking behaviour of binder jet printed parts. Lastly, controlled Electron Channeling Contrast Imaging (cECCI) will be presented for crystal defect identification and orientation indexing.

Details
Date: April 22, 2024 (One-day event), 8:30 AM to 4:30 PM
Venue: 70 Nanyang Drive, LT3 (NS), NS4-02-32, Level L2, North Spine, NTU, Singapore 637331

Agenda

April 22, 2024

08.30 – 09.00

Registration

09.00 – 09.10

Opening address by VAST
Landscape of Semicon Vietnam

09.10 – 09.20

Opening address by Tramina/ZEISS
Title of the opening

09.20 – 09.25

ZEISS gift to VAST & photo taking

09.25 - 10.00

Perform High-Resolution Imaging, Advanced Analytics and Correlative Microscopy Workflow of Semiconductor Materials with ZEISS Gemini FE-SEM
Dr Feng Lin Ng, ZEISS

Abstract

10.00 – 10.40

Non-Destructive 3D Imaging, Advanced AI-driven Analytics and Correlative Microscopy Workflow of Semiconductor Materials with ZEISS Xradia Versa X-ray Microscope (XRM)
Dr Feng Lin Ng, ZEISS

Abstract

10.40 - 11.00

Tea break

11.00 - 11.40

From Macro Imaging to Nanometer Defect Mapping with ZEISS Light Microscope Solutions
Dr Feng Lin Ng, ZEISS

Abstract

11.40 - 12.10

Q&A | Expert discussion

12.10 - 13.10

Networking lunch

Join us for an insightful day of learning and exploration into the world of 3D X-Ray microscopy!

Speaker Ng Feng Lin Business Development Specialist, ZEISS

Dr. Feng Lin Ng is a Business Development Specialist in APAC for Materials Research atZEISS Research Microscopy Solutions. She received her PhD degree in Materials Science and Engineering from the Nanyang Technological University, Singapore, focusing on the development of polymeric cell culture systems. Prior to ZEISS, she worked as a Research Scientist at SIMTech, A*STAR with a focus on polymer process development and its materials-process-properties study for applications in MedTech, Aerospace & Sustainability. She currently supports the business development of Electron & X-Ray Microscopy for Materials Science research in ZEISS.

Speaker WD Speaker Member, WD

Hrishikesh Bale, PhD, specializes in application development for laboratory 3D X-ray imaging techniques. His research focuses on 3D diffraction contrast tomography and in situ micro- and nano-mechanical testing using X-ray computed tomography. He has a strong background in materials science and mechanical engineering, with over a decade of experience in synchrotron X-ray microscopy and tomography.

Speaker ALS Speaker Sales Manager, ALS

Punit Kumar is presently a postdoc at the Department of Materials Science and Engineering, University of California, Berkeley. Previously he was a postdoc at the School of Mechanical and Aerospace Engineering, Nanyang Technological University, Singapore. He did his Ph.D. thesis research on the fracture and fatigue behavior of additively manufactured Ti-alloy at the Materials Engineering department, Indian Institute of Science Bangalore.

Please register here

กำลังโหลดแบบฟอร์ม...

Dr Hrishikesh Bale, ZEISS

New Techniques, Classical Problems: Advancing Materials Research Through Latest Innovations In X-Ray Microscopy

09.15 – 10.00

In this session, we‘ll explore the emerging research applications, along with underlying technology and methodology, stemming from 3D X-ray microscopy (XRM). As a nondestructive characterization method, XRM allows us to uniquely evaluate the internal structures of our samples and specimens at sub-micron resolution, covering multiple contrast mechanisms and length scales. Moreover, 4D investigation of structures via in situ or ex-situ repeated imaging provides new opportunities for understanding materials evolution/degradation processes, and correlative workflows linking XRM with other modalities such as EM or FIB-SEM offer the chance to easily span across a range of length scales. Several examples will be presented, emphasising the latest developments and an outlook towards the future.

Dr Punit Kumar, University of California

Effect Of The Heat Treatment And Surface Treatment On The Fatigue Behavior Of 3D Printed Titanium Alloy

10.00 – 10.20

A major limitation of additively manufactured metal parts using laser powder bed fusion (LPBF) processes is their low fatigue resistance vis-á-vis the parts manufactured using conventional processes. Where porosity, inevitable in the parts produced by powder-based processes, is the cause of the poor performance. In this work, the effects of process parameters such as laser power, layer thickness, and scan rotation on the defect formation and their influence on the fatigue performance of LPBF Ti-6Al-4V, the most widely used aerospace grade Ti alloy, were investigated using 3D tomography. The possibility of enhancing fatigue resistance via post-processing heat treatment and subsequent shot peening is also examined. A fracture mechanics-based failure envelope was proposed as a guide for the use of LPBF Ti64 in fatigue loading applications, assuming the presence of pores is inevitable.

Dr Qiang Li, NTU

Fatigue Resistance Of The Binder Jet Printed 17-4 Precipitation Hardened Martensitic Stainless Steel

11.00 – 11.20

The unnotched fatigue behavior of the 17-4 PH martensitic (α’) stainless steel, additively manufactured using the binder jet printing technique (BJP), with varying porosity levels and in two different aging conditions are investigated and are compared to that of the conventionally manufactured (CM) alloy. As expected, fatigue strength is enhanced by the reduction in porosity, with hot isostatic pressing of the BJP alloy resulting in a fatigue strength that is similar to the CM alloy. Over-aging of the alloy improves its fatigue resistance further. These variations are rationalized by recourse to the analysis of the microstructure-defect interactions based on microscopy and x-ray tomography. Furthermore, it was found that the combination of plasticity induced crack closure mechanisms and transformation induced plasticity are dominant at the fatigue crack tip of the over-aged alloy. Fracture mechanics-based Kitagawa and Takahashi diagrams were utilized to illustrate the significance of pore size on the unnotched fatigue resistance of BJP 17-4 PH alloys. Lastly, pore distribution played a critical role in the propagation of fatigue cracks, which eventually affected the fatigue life. These results are discussed in terms of designing alloy fabrication using BJP specifically for cyclic loading conditions.